Sterling-LWB - 2.4 GHz Wi-Fi & Bluetooth module - 802.11 b/g/n / BT 2.1+EDR / BLE 4.1 wireless connectivity

2.4 GHz Wi-Fi & Bluetooth Smart Ready multi-standard module

LSR's Sterling-LWB™ 2.4 GHz Wi-Fi® and Bluetooth® Smart Ready multi-standard module provides engineers with more options, more certifications and a greater variety of antenna options, offering greater flexibility to meet the challenging requirements of many wireless designs. This certified module is based upon the Cypress (formerly Broadcom) CYW4343W chipset, and supports IEEE 802.11 b/g/n, BT 2.1+EDR, and BLE 4.1 wireless connectivity.  The module comes in three configurations to best address specific applications, and features an industrial temperature rating (-40° to +85° C) and an industry-leading breadth of certifications and antenna options.

Key features:

  • Delivers IEEE 802.11 b/g/n, BT 2.1+EDR, and BLE 4.1 wireless connectivity
  • Based on next-generation silicon from Cypress (CYW4343W)
  • Three configuration options available:
    • SiP Module (10 mm x 10 mm x 1.2 mm)
    • Module with chip antenna (15.5 mm x 21 mm x 2 mm)
    • Module with external U.FL antenna port (15.5 mm x 21 mm x 2 mm)
  • All three configurations feature Industrial Temperature rating (-40° to +85° C)
  • Enhanced collaborative co-existence algorithms
  • Best-in-class output power and Rx sensitivity
  • Optional integrated advanced chip antenna offers greater resistance to de-tuning vs. trace or standard chip antennas
  • Direct driver support for both Linux and Android
  • SIG certified Bluetooth driver

For sales and technical development support from our in-house engineering team, please contact the Alpha Micro team.

  • Operating temperature: -40 to +85°C
  • Operating voltage: 3.0V to 3.6V
  • WLAN Transmit Power:
    • 802.11b, 11 Mbps CCK: 17.5 dBm
    • 802.11g, 54 Mbps rate: 14.0 dBm
    • 802.11n, 65 Mbps MCS7: 12.5 dBm
  • WLAN Rx Sensitivity:
    • 802.11b, 11 Mbps CCK: -88 dBm
    • 802.11g, 54 Mbps rate: -75 dBm
    • 802.11n, 65 Mbps MCS7: -72 dBm
  • Bluetooth Tx Power: 8.5dBm (GFSK)
  • Bluetooth Rx Sensitivity -90 dBm (GFSK)
  • Security & building automation
  • Internet of Things (IoT)
  • M2M connectivity
  • Smart gateways
Part No.
Pack Sizes
LSR Sterling-LWB module, U.FL connector
Cut tape

LSR Sterling-LWB module, U.FL connector

Reel of 1000
LSR Sterling-LWB module, chip antenna
Cut tape

LSR Sterling-LWB module, chip antenna

Reel of 1000
450-0159C LSR Sterling-LWB module, base module (SiP) Cut tape
450-0159R LSR Sterling-LWB module, base module (SiP) Reel of 2000
450-0155 LSR Sterling-LWB development board, U.FL connector, SD card form factor Each
450-0156 LSR Sterling-LWB development board, chip antenna, SD card form factor Each
450-0173 LSR Sterling-LWB for WICED™ carrier board, plugs directly into virtually any STM32F4xx Discovery Kit Each

Sterling-LWB development kit with SD card form factor


The Sterling-LWB development kit features a convenient SD Card form factor for convenience compatibility with a variety of Microprocessor development platforms, such as NXP/Freescale i.MX6. Full driver support for Linux, along with step-by-step user guides, dramatically simplifies adding a powerful Wi-Fi module to your Linux-based development project. The Dev Kit for the Sterling-LWB module with u.FL connector also a FlexPIFA™ Antenna for your evaluation and development efforts

The Sterling-LWB Dev Kit's driver supports the latest Linux version and provides backports to v4.1.15 of the Linux kernel, and has been validated to work with a number of i.mx6 development platforms.

Sterling-LWB for WICED™ carrier board


Development is fast and easy with a carrier board that plugs directly into virtually any STM32F4xx Discovery Kit. Design implementation is straight-forward as well, as source CAD files make an outstanding starting point.

You can now leverage the high-performance Sterling-LWB™ module for embedded applications as well! The Sterling-LWB for WICEDTM reference platform provides a very simple and fast way to add both Wi-Fi and BLE v4.1 connectivity to your microcontroller-based design utilizing the power of Cypress' robust WICEDTM software development kit. The low cost, pre-certified Sterling-LWB is now validated with the STM32F411 MCU and can be migrated to other popular MCU's with an SDIO interface, giving you unmatched speed in adding Wi-Fi and BLE to your application. In addition to the carrier board hardware, this comprehensive reference platform features extensive documentation and software examples, TiWiConnect™ cloud connectivity and ModuleLink™ mobile app for easy development and integration.

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Last updated: 9 December 2019