60-SIPT - 802.11ac & 2X2 MU-MIMO Wi-Fi + Bluetooth Smart Ready v4.2 SiP module

802.11ac, 2x2 MU-MIMO, Bluetooth 4.2 and Bluetooth 5 ready hardware on one low power SiP module

Powered by the powerful Marvell 88W8997 chipset, Laird's 60-SIPT Series Wi-Fi + Bluetooth modules achieve the best possible connectivity and performance in any RF environment. With industry-leading software, broad OS support, and multiple form factors, Laird's 60 Series offers flexibility to meet your needs. The 60 Series introduces 802.11ac, 2x2 MU-MIMO, Bluetooth 4.2 and Bluetooth 5 ready hardware on one low power module, delivering future-ready cutting edge technology for your product.

Building on the security and robustness inherited from Laird's expertise in its 40, 45, and 50 Series modules means ultra-high data rates, improved performance, and the most reliable wireless in crucial applications such as medical and industrial.

Key features:

  • New wireless capabilities: Advanced 802.11ac Wave 2, 2x2 MU-MIMO, advanced power save, optimised internal BT/Wi-Fi co-existence, fast roam
  • New form factor: Extremely small 14mm x 13mm SiP module
  • Bluetooth 4.2: Enables Classic Bluetooth and Low Energy mode with latest security and throughput enhancements, all on Bluetooth5 ready hardware
  • Pre-calibrated for performance: Tuned in manufacturing

For sales and technical development support from our in-house engineering team, please contact the Alpha Micro team.

Antenna Options Pin access
Bluetooth Version Bluetooth 4.2 (Bluetooth 5 ready hardware)
Chipset Marvell 88W8997
Compliance Certifications and approvals for FCC (USA), IC (Canada), ETSI (Europe), KCC (Korea). Pending: Giteki (Japan), RCM (AUS/NZ)
Connector Type SDIO, USB, & PCIE options
Data Rate Up to 866 Mbps
Data Storage - Flash Memory Yes
Dimensions 14.0mm(L) x 13.0mm(W) x 1.7mm(D)
Encryption WEP, TKIP, AES
Frequencies 2.4GHz to 2.495GHz, 5.15GHz to 5.825GHz (including DFS)
Frequency Range (Max) 5825MHz
Frequency Range (Min) 2400MHz
GPS Yes
Logical Interfaces SDIO, USB, & PCIE options
Network Architecture Infrastructure and ad-hoc
Operating Channels (2.4GHz) ETSI: 13 (3 non-overlapping); FCC: 11 (3 non-overlapping); MIC: 14 (4 non-overlapping); KC: 13 (3 non-overlapping)
Operating Channels (5GHz) ETSI: 19 non-overlapping; FCC: 24 non-overlapping; MIC: (Japan): 19 non-overlapping; KC: 19 non-overlapping
Operating Humidity 10 to 90% humidity (non-condensing)
Operating Systems Supported Linux 3.x.x kernel and newer, Android 4.1.2 (Jellybean) and newer
Product Line 802.11ac & 2x2 MU-MIMO Wi-Fi + Bluetooth Smart Ready v4.2
Protocols Wi-Fi Media Access Protocol
Security WEP, WPA, WPA2
Wireless Specification 802.11ac Wi-Fi + Bluetooth v4.2
Part No. Description Pack Size
ST60-SIPT 802.11ac + BT4.2 60 Series hardware combined with Sterling Series Professional software Reel of 2000
ST60-SIPT-C 802.11ac + BT4.2 60 Series hardware combined with Sterling Series Professional software Cut tape (MOQ may apply)
DVK-ST60-SIPT Development kit for the ST60-SIPT module Each

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Last updated: 24 October 2017